Display device and manufacturing method thereof

ABSTRACT

A display device includes: a substrate including a first flat area, a second flat area, and a bending area between the first flat area and the second flat area; a display unit overlapping the first flat area and disposed on a surface of the substrate; first and second protection layers on an opposing surface of the substrate and overlapping the first and second flat areas, respectively. The first and second protection layers include a hardening member including a photo-hardening resin, the first protection layer includes a first inclination part at an end, the second protection layer includes a second inclination part at an end, the first inclination part has a first inclination angle with the opposing surface, the second inclination part has a second inclination angle with the opposing surface, and the first and second inclination angles are in a range of about 10 degrees to about 90 degrees.

This application is a continuation of U.S. patent application Ser. No.16/856,034, filed on Apr. 23, 2020, which claims priority to KoreanPatent Application No. 10-2019-0076538, filed on Jun. 26, 2019, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND (a) Field

The disclosure relates to a display device and a manufacturing method ofthe display device.

(b) Description of the Related Art

Display devices such as liquid crystal displays and organic lightemitting devices may be manufactured by forming various layers andelements on a substrate.

A glass substrate may be used as the substrate of the display device,but to glass substrate is typically heavy and fragile. In addition,since the glass substrate has a hard property, it may be difficult todeform the display device.

Recently, a display device using a substrate having flexible,lightweight, impact-resistant, and easily deformable properties has beendeveloped. The display device using the flexible substrate may bedesigned to bend the edge of a display panel with a pad portion, andthus a dead space may be reduced compared to the display device usingthe substrate having the rigid property such as a glass substrate.

SUMMARY

Exemplary embodiments relate to a display device and a manufacturingmethod thereof for simplifying a process by selectively patterning aprotection layer on a surface of a substrate and for easy bending byforming an end of the protection layer to be inclined.

According to an exemplary embodiment, a display device includes: asubstrate including a first flat area, a second flat area, and a bendingarea disposed between the first flat area and the second flat area; adisplay unit overlapping the first flat area and disposed on a surfaceof the substrate; a first protection layer disposed on an opposingsurface of the substrate, which is opposite to the surface of thesubstrate, and overlapping the first flat area; and a second protectionlayer disposed on the opposing surface of the substrate and overlappingthe second flat area, where the first protection layer and the secondprotection layer include a hardening member including a photo-hardeningresin, the first protection layer includes a first inclination part atan end thereof, the second protection layer includes a secondinclination part at an end thereof, the first inclination part has afirst inclination angle with the opposing surface of the substrate, thesecond inclination part has a second inclination angle with the opposingsurface of the substrate, and each of the first inclination angle andthe second inclination angle is greater than or equal to about 10degrees and less than or equal to about 90 degrees.

In an exemplary embodiment, the first inclination angle and the secondinclination angle may be in a range of about 30 degrees to about 45degrees.

In an exemplary embodiment, as the first inclination angle and thesecond inclination angle decrease, a strain received by the substrate atthe bending area may decrease.

In an exemplary embodiment, a maximum value of the strain may be about1.4% during bending of the display device, and a value of the strain isdefined as: (strain length)/(initial length)×100(%).

In an exemplary embodiment, the first inclination part may be disposedat a part where the first flat area is adjacent to the bending area, andthe second inclination part may be disposed at a part where the secondflat area is adjacent to the bending area.

In an exemplary embodiment, the photo-hardening resin may include atleast one material selected from an acrylate-based compound including anacrylate-based polymer, a polyurethane and SiO, and the photo-hardeningresin may further include at least one material selected from anacryl-based resin, a butyl rubber, a vinyl acetate resin, an ethylenevinyl acetate (“EVA”) resin, a natural rubber, nitriles, a silicateresin, a silicone rubber, and a styrene block polymer.

In an exemplary embodiment, each of the first protection layer and thesecond protection layer may include a first auxiliary layer, a secondauxiliary layer and a third auxiliary layer, which are sequentiallystacked one on another from the opposing surface of the substrate.

In an exemplary embodiment, the third auxiliary layer may include a heatdissipating material having heat conductivity.

In an exemplary embodiment, the heat dissipating material may be acarbon composite material including at least one selected from graphite,a carbon nanotube (“CNT”), a carbon fiber, and graphene.

In an exemplary embodiment, the third auxiliary layer may furtherinclude a dispersant including a dispersion photo-hardening resin.

In an exemplary embodiment, the first auxiliary layer may include atleast one material selected from an acryl-based resin, a butyl rubber, avinyl acetate resin, an EVA resin, a natural rubber, nitriles, asilicate resin, a silicone rubber and a styrene block polymer, and thesecond auxiliary layer may include at least one material selected fromacrylate-based compounds including an acrylate-based polymer,polyurethane and SiO.

In an exemplary embodiment, a connection part may be disposed on theopposing surface of the substrate at the bending area, and theconnection part may include a same material as the second auxiliarylayer.

In an exemplary embodiment, the first protection layer and the secondprotection layer may be spaced apart from each other, and a spacebetween the first protection layer and the second protection layer mayoverlap the bending area.

In an exemplary embodiment, the display device may further include apolarization layer disposed on the display unit, the display device mayfurther include a driving unit overlapping the second flat area anddisposed on the surface of the substrate, the first protection layer mayoverlap the display unit and the polarization layer, and the secondprotection layer may overlap the driving unit.

According to an exemplary embodiment, a display device includes: asubstrate including a first flat area, a second flat area, and a bendingarea disposed between the first flat area and the second flat area; adisplay unit overlapping the first flat area and disposed on a surfaceof the substrate; a first protection layer disposed on an opposingsurface of the substrate, which is opposite to the surface of thesubstrate, and overlapping the first flat area; and a second protectionlayer disposed on the opposing surface of the substrate and overlappingthe second flat area, where the first protection layer and the secondprotection layer include a hardening member including a photo-hardeningresin, the first protection layer includes a first inclination parthaving a first inclination angle at an end thereof, the secondprotection layer includes a second inclination part having a secondinclination angle at an end thereof, and the first protection layer andthe second protection layer include a heat dissipating material havingheat conductivity.

In an exemplary embodiment, the first inclination angle and the secondinclination angle may be greater than or equal to about 10 degrees andless than or equal to about 90 degrees.

In an exemplary embodiment, the heat dissipating material may be acarbon composite material including at least one material selected fromgraphite, a CNT, a carbon fiber, and graphene.

In an exemplary embodiment, the first protection layer and the secondprotection layer may further include a dispersant including a dispersionphoto-hardening resin.

In an exemplary embodiment, a manufacturing method of a display deviceincludes: providing a display unit including a plurality of thin filmtransistors on one surface of a substrate; and coating and curing aphoto-hardening resin on the opposing surface of the substrateoverlapping one surface of the substrate to form a first protectionlayer and a second protection layer, wherein the photo-hardening resinis coated through an Inkjet process.

In an exemplary embodiment, the coating of the photo-hardening resin mayinclude coating the photo-hardening resin by a printing device includinga nozzle, the nozzle may discharge droplets of the photo-hardeningresin, the display device may include a first flat area in which thedisplay unit is provided, a bending area adjacent to the first flatarea, and a second flat area adjacent to the bending area, and thenozzle may discharge fewer droplets of the photo-hardening resin fromthe first flat area toward the bending area and may discharge fewerdroplets of the photo-hardening resin from the second flat area towardthe bending area.

According to exemplary embodiments, by selectively patterning theprotection layer, the process may be simplified to provide the displaydevice and the manufacturing method thereof.

According to exemplary embodiments, by forming the end of the protectionlayer to be inclined, it is possible to effectively control the strainreceived by the substrate during bending, and to thereby provide thedisplay device capable of easy bending and the manufacturing methodthereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of embodiments of the disclosure will bemore apparent from the following description taken in conjunction withthe accompanying drawings, in which:

FIG. 1 is a perspective view schematically showing a part of a displaydevice according to an exemplary embodiment;

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1.

FIG. 3 is a cross-sectional view showing a portion of the display deviceof FIG. 2 in a state in which a substrate is unfolded;

FIG. 4 is a graph showing a strain depending on an inclination angle ina first part and a second part of FIG. 2;

FIG. 5 is a graph showing a strain depending on an inclination angle ina third part and a fourth part of FIG. 2;

FIG. 6 is a cross-sectional view of a display device according to acomparative example of FIG. 5;

FIG. 7 is a cross-sectional view of a display device according to acomparative example of FIG. 5;

FIG. 8 is a schematic cross-sectional view of a display device accordingto an alternative exemplary embodiment;

FIG. 9 is a schematic cross-sectional view of a display device accordingto another alternative exemplary embodiment;

FIG. 10 is a schematic cross-sectional view showing a state in which asubstrate is unfolded in a display device according to an exemplaryembodiment of FIG. 9;

FIG. 11 is a schematic cross-sectional view of a display deviceaccording to another alternative exemplary embodiment;

FIG. 12 is a schematic cross-sectional view of a display deviceaccording to another alternative exemplary embodiment;

FIG. 13 is a cross-sectional view showing a state in which a substrateis folded in a display device according to an exemplary embodiment ofFIG. 12;

FIG. 14 is a schematic cross-sectional view of a display deviceaccording to another alternative exemplary embodiment;

FIG. 15 is a schematic cross-sectional view of a display deviceaccording to another alternative exemplary embodiment;

FIG. 16 is a cross-sectional view of a thin film transistor and alight-emitting element of a display unit according to an exemplaryembodiment;

FIG. 17 is a schematic top plan view showing a manufacturing method of adisplay device according to an exemplary embodiment; and

FIG. 18 is a schematic cross-sectional view showing a manufacturingmethod of a display device according to an exemplary embodiment.

DETAILED DESCRIPTION

The invention will be described more fully hereinafter with reference tothe accompanying drawings, in which various embodiments of the inventionare shown. This invention may, however, be embodied in many differentforms, and should not be construed as limited to the embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the invention to those skilled in the art.

The drawings and description are to be regarded as illustrative innature and not restrictive. Like reference numerals designate likeelements throughout the specification.

Further, in the drawings, a size and thickness of each element arearbitrarily represented for better understanding and ease ofdescription, and the present invention is not limited thereto. In thedrawings, the thickness of layers, films, panels, areas, etc., areexaggerated for clarity. In the drawings, for better understanding andease of description, the thicknesses of some layers and areas areexaggerated.

It will be understood that when an element such as a layer, film, area,or substrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” another element, there are no intervening elements present. Further,in the specification, the word “on” or “above” means positioned on orbelow the object portion, and does not necessarily mean positioned onthe upper side of the object portion based on a gravitational direction.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Further, in the specification, the phrase “on a plane” means viewing theobject portion from a top, and the phrase “on a cross-section” meansviewing a cross-section of which the object portion is vertically cutfrom the side.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system).

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

Now, a display device according to an exemplary embodiment will bedescribed with reference to FIG. 1 to FIG. 3. FIG. 1 is a perspectiveview schematically showing a part of a display device according to anexemplary embodiment, FIG. 2 is a cross-sectional view taken along lineII-II of FIG. 1, and FIG. 3 is a cross-sectional view showing a portionof the display device of FIG. 2 in a state in which a substrate isunfolded.

In an exemplary embodiment of the display device, a part of a substrate100 is bent or folded as shown in FIG. 1 and FIG. 2.

The substrate 100 may include at least one of various materials having aflexible or bendable characteristic. In one exemplary embodiment, forexample, the substrate 100 may include a polymer resin such aspolyethersulphone (“PES”), polyacrylate (“PAR”), polyetherimide (“PEI”),polyethylene naphthalate, (“PEN”), polyethylene terephthalate (“PET”),polyphenylene sulfide (“PPS”), polyarylate, polyimide (“PI”),polycarbonate (“PC”), cellulose acetate propionate (“CAP”), or the like.

The substrate 100 includes a first flat area F1 and a second flat areaF2, and a bending area BA disposed between the first flat area F1 andthe second flat area F2. The substrate 100 may include a bending area BAthat is bent with respect to a bending axis BX parallel to an extendingdirection of an x-axis. Herein, a z-axis may be an axis in a directionparallel to a thickness direction of the substrate 100, and the x-axismay be an axis in a direction parallel to a width or length direction ofthe substrate 100, and a y-axis may be an axis in a directionperpendicular to the x-axis and the z-axis.

The first flat area F1 of the substrate 100 overlaps a display unit 200and a polarization layer 400. In an exemplary embodiment, the first flatarea F1 may include a partial area outside the display unit 200 as shownin FIG. 2, but not being limited thereto. The display unit 200 and thepolarization layer 400 are disposed on one surface of the substrate, andhereinafter, the one surface on which the display unit 200 and thepolarization layer 400 are disposed is referred to as a first surfacePL1. FIG. 1 to FIG. 3 show that the edges of the display unit 200 andthe polarization layer 400 coincide (or aligned) with each other, butnot being limited thereto. Alternatively, the edges of the display unit200 and the polarization layer 400 may not coincide with each other.

The display unit 200 may include a plurality of thin film transistorsand a light-emitting element connected thereto, which will be describedlater in detail with reference to FIG. 16. Herein, for convenience ofdescription, exemplary embodiments in which the display unit 200includes the light-emitting element, but not being limited thereto.Alternatively, the display unit 200 includes may include another type oflight emitting or control element, e.g., a liquid crystal element.

Although not shown in the drawings, an exemplary embodiment of thedisplay device may further include a touch unit (not shown) disposedbetween the display unit 200 and the polarization layer 400. The touchunit may acquire coordinate information by detecting external touchinformation and generates an input signal corresponding thereto. Thetouch unit may be provided as a separate unit to be mounted on thedisplay unit 200, or may be directly formed on the display unit 200 tobe embedded therein.

The polarization layer 400 may be disposed on the display unit 200. Thepolarization layer 400 may reduce external light reflection. Whenexternal light passes through the polarization layer 400 and isreflected by the display unit 200 and then passes through thepolarization layer 400 again, the phase of the external light may bechanged. As a result, the phase of the reflected light and the phase ofthe external light entering the polarization layer 400 are different,and thus destructive interference may occur between the reflected lightand the external light.

In an exemplary embodiment, an adhesive layer (not shown) may bedisposed between the polarization layer 400 and the display unit 200.The adhesive layer may be a transparent adhesive layer. In one exemplaryembodiment, for example, the adhesive layer may include an opticallyclear adhesive (“OCA”), an optically clear resin (“OCR”), or a pressuresensitive adhesive (“PSA”).

The second flat area F2 and the bending area BA may include anon-display area corresponding to an outer or peripheral part of thedisplay unit 200.

A driving unit 500 may be disposed in the second flat area F2 of thesubstrate 100. The driving unit may be disposed on the first surface PL1of the substrate. The driving unit 500 may be connected to a pad unitdisposed on the substrate 100 to supply a data signal and a gate signal(hereinafter, collectively referred to ‘a signal’) to a gate line and adata line. In an exemplary embodiment, the driving unit 500 may be adriver integrated circuit (“IC”), and may be disposed or mounted on apad unit of the substrate 100. In such an embodiment, the pad unit maybe directly electrically connected to the driver IC.

In an exemplary embodiment, a flexible circuit board 800 may beconnected with the pad unit of the substrate 100 and an IC may bemounted on the flexible circuit board 800. The flexible circuit boardmay be disposed on the first surface PL1 of the substrate. The flexiblecircuit board 800 may be applied with a chip on film (“COF”), a chip onplastic (“COP”), or a flexible printed circuit (“FPC”), and the IC maybe disposed or mounted on the flexible circuit board 800 to supply asignal to the display unit 200.

Protection layers 710 and 720 may be disposed on a rear surface of thesubstrate 100. The rear surface of the substrate 100, where theprotection layers 710 and 720 are disposed, is another surface of thesubstrate 100 opposite to the first surface PL1 on which the displayunit 200 is disposed. Hereinafter, the other surface of the substrate100 will be referred to as a second surface PL2. In such an embodiment,the protection layers 710 and 720 are disposed on the second surface PL2of the substrate 100.

In an exemplary embodiment, the display device may include a firstprotection layer 710 overlapping the first flat area F1 on the secondsurface PL2 of the substrate 100 and a second protection layer 720overlapping the second flat area F2 on the second surface PL2 of thesubstrate 100.

An empty space defined between the first protection layer 710 and thesecond protection layer 720 may overlap the bending area BA. In such anembodiment, no layer may be disposed on the second surface PL2 of thesubstrate 100 corresponding to the bending area BA.

The first protection layer 710 may overlap the first flat area F1 andmay also overlap the display unit 200 and the polarization layer 400.The first protection layer 710 may be in direct contact with thesubstrate 100.

In an exemplary embodiment, the first protection layer 710 has a firstinclination part 711 at an end thereof where the first flat area F1 isadjacent to the bending area BA. In such an embodiment, the end of thefirst protection layer 710 may be formed to be inclined. Although notshown in FIG. 1 to FIG. 3, the first protection layer 710 may also havean inclination part at an end opposite to the end having the firstinclination part 711.

In such an embodiment, as the end portion of the first protection layer710 may be formed to be inclined, the space in the bending area BA maybe effectively secured during bending. In such an embodiment, bycontrolling the angle of the first inclination part 711 of the firstprotection layer 710, a strain applied to the substrate 100 in thebending area BA may be effectively controlled or reduced, therebyfacilitating the bending.

The first inclination part 711 of the first protection layer 710 mayhave a shape that is inclined toward the second surface PL2 of thesubstrate 100. The first inclination part 711 of the first protectionlayer 710 may become thinner toward the end. The first inclination part711 may have a cross-section of a smooth shape. Accordingly, the firstprotection layer 710 may have the smooth shape without any protrudedpart.

Referring to FIG. 3, in an exemplary embodiment, the outermost pointwhere the first inclination part 711 of the first protection layer 710meets the second surface PL2 of the substrate 100 is referred to as afirst contact point Q1. That is, the edge of the first protection layer710 is at the first contact point Q1. In FIG. 3, the first contact pointQ1 is shown as one point, but referring to FIG. 1, as the first contactpoint Q1 may define a straight line substantially parallel to thebending axis BX.

In FIG. 3, a straight line perpendicular to the substrate 100 at thefirst contact point Q1 is referred to as a first straight line 11, whichis an imaginary line. The first inclination part 711 of the firstprotection layer 710 has a first inclination angle θ1. The firstinclination angle θ1 is the angle between the first inclination part 711and the substrate 100 at the first contact point Q1.

The first inclination angle θ1 has a value greater than about 10 degreesand less than about 90 degrees, and the strain of the substrate 100 whenbending in the corresponding range may be substantially reduced. In oneexemplary embodiment, for example, the first inclination angle θ1 may bein a range of about 30 degrees to about 45 degrees, and the decreasingdegree of the strain received by the substrate 100 is maximized whenbending in the corresponding range, thereby allowing the stable andeffective bending of the substrate 100.

In an exemplary embodiment, the second protection layer 720 may overlapthe second flat area F2, and may overlap a portion of the driving unit500 and the flexible circuit board 800.

The second protection layer 720 has a second inclination part 721 at anend thereof where the second flat area F2 is adjacent to the bendingarea BA. The second protection layer 720 may have an inclination part atan end opposite to the end of the second inclination part 721. That is,the second protection layer 720 may have the inclination part even inthe part where the substrate 100 overlaps the flexible circuit board800.

In an exemplary embodiment, as described above, the end of the secondprotection layer 720 may be formed to be inclined, thereby effectivelysecuring a space in the bending area BA during bending. In such anembodiment, by adjusting the angle of the second inclination part 721 ofthe second protection layer 720, the strain received by the substrate100 in the bending area BA may be effectively controlled or reduced,thereby facilitating the bending.

The second inclination part 721 of the second protection layer 720 mayhave a shape that is inclined toward the second surface PL2 of thesubstrate 100. The second inclination part 721 of the second protectionlayer 720 may have a thickness that becomes thinner toward the end. Thesecond inclination part 721 may have a cross-section of a smooth shape.Accordingly, the second protection layer 720 may have a smooth shapewithout any protruded part.

Referring to FIG. 3, the outermost point where the second inclinationpart 721 of the second protection layer 720 meets the second surface PL2of the substrate 100 is referred to as a second contact point Q2. Thatis, the edge of the second protection layer 720 is at the second contactpoint Q2. In FIG. 3, the second contact point Q2 is shown as one point,but referring to FIG. 1, the second contact point Q2 may define astraight line substantially parallel to the bending axis BX.

In FIG. 3, a straight line perpendicular to the substrate 100 at thesecond contact point Q2 is referred to as a second straight line 12,which is an imaginary line. The second inclination part 721 of thesecond protection layer 720 has a second inclination angle θ2. Thesecond inclination angle θ2 is the angle between the second inclinationpart 721 and the substrate 100 at the second contact point Q2.

The second inclination angle θ2 has a value greater than about 10degrees and less than about 90 degrees, and the strain of the substrate100 when bending in the corresponding range may be substantiallyreduced. In one exemplary embodiment, for example, the first inclinationangle θ1 may be in a range of about 30 degrees to about 45 degrees, andthe decreasing degree of the strain received by the substrate 100 ismaximized when bending in the corresponding range, thereby facilitatingthe stable and free bending of the substrate 100.

The first inclination angle θ1 and the second inclination angle θ2 maybe different from each other or may be the same as each other.

Referring to FIG. 3 along with FIG. 2, four parts P1, P2, P3, and P4 aredefined in the substrate 100.

First, the first part P1, the second part P2, and the third part P3 onthe bending area BA side will be described. The boundary part where thebending area BA of the substrate 100 and the first flat area F1 meet isreferred to as a first part P1. The boundary part where the bending areaBA of the substrate 100 and the second flat area F2 meet is referred toas a third part P3. In the bending area BA of the substrate 100, thepart disposed between the first part P1 and the third part P3 isreferred to as a second part P2. The second part P2 may be the middlepart of the bending area BA, but the position of the second part P2 isnot limited in the bending area BA.

The second part P2 is an area corresponding to the space between thefirst protection layer 710 and the second protection layer 720, and noconstituent elements may be positioned on the second surface PL2 of thesecond part P2 of the substrate 100.

Referring to FIG. 3, the first part P1 of the substrate 100 may bedisposed on the first straight line 11 that is the boundary of the firstflat area F1 and the bending area BA. The third part P3 of the substrate100 may be disposed on the second straight line 12 which is the boundarybetween the second flat area F2 and the bending area BA. That is, thefirst part P1 may overlap the first straight line 11 and the third partP3 may overlap the second straight line 12.

As shown in FIG. 2 and FIG. 3, the boundary part where the substrate 100meets the display unit 200 and the polarization layer 400 is referred toas a fourth part P4. According to an alternative exemplary embodiment,the edges of the display unit 200 and the polarization layer 400 may notcoincide. In such an embodiment, the fourth part P4 may be a boundarypart of the substrate that meets (or overlaps an edge of) either one ofthe display unit 200 and the polarization layer 400.

The first part P1, the second part P2, the third part P3, and the fourthpart P4 of the substrate 100 receive the stress when being bent from theunfolded state of FIG. 3 to the bending state of FIG. 2 and then thedeformation occurs. In such an embodiment, the display device includesthe inclination parts 711 and 721 on the end of the protection layers710 and 720, such that the interference in the bending area BA may beminimized. In such an embodiment, by controlling (e.g., setting to apredetermined value of) the inclination angles θ1 and θ2 of theinclination parts 711 and 721, the strain of the substrate 100 iseffectively controlled when bending, thereby allowing stable and easybending of the substrate 100.

The strain received when each part of the substrate 100 is bent will bedescribed later in detail with reference to FIG. 4 and FIG. 5.

The first protection layer 710 is a layer formed by curing aphoto-hardening resin coated through a printing process, for example, anInkjet process. In the process of curing the photo-hardening resin, thefirst inclination part 711 of the first protection layer 710 may betapered toward the substrate 100. The process of forming the firstprotection layer 710 will be described later in detail with reference toFIG. 17 and FIG. 18.

Next, a material included in the protection layers 710 and 720 will bedescribed.

The first protection layer 710 may be formed using a photo-hardeningresin. The photo-hardening resin may include at least one materialselected from acrylate-based compounds, including acrylate-basedpolymer, polyurethane, and SiO, but not being limited thereto. In suchan embodiment, the first protection layer 710 may include anyconventional material that forms a photo-hardening resin. In oneexemplary embodiment, for example, the photo-hardening resin may furtherinclude a photoinitiator, a heat stabilizer, an antioxidant, anantistatic agent, or a slip agent.

In an exemplary embodiment, the photo-hardening resin may furtherinclude at least one material selected from an acryl-based resin, abutyl rubber, a vinyl acetate resin, an ethylene vinyl acetate (“EVA”)resin, a natural rubber, nitriles, a silicate resin, a silicone rubber,and a styrene block polymer. In such an embodiment, where thephoto-hardening resin further includes at least one material selectedfrom the above-described materials, the photo-hardening resin may haveimproved adhesive strength.

The first protection layer 710 may include a hardening member of thephoto-hardening resin described above. That is, the first protectionlayer 710 may include a hardening member including at least one materialselected from the acrylate-based compounds including an acrylate-basedpolymer, polyurethane, and SiO. In an exemplary embodiment, the firstprotection layer 710 may further include the photoinitiator, the thermalstabilizer, the antioxidant, the antistatic agent or the slip agent,which remain in the first protection layer 710 after the photo-hardeningresin is cured.

The first protection layer 710 may also include at least one materialselected from an acryl-based resin, butyl rubber, a vinyl acetate resin,an EVA resin, a natural rubber, nitriles, a silicate resin, a siliconerubber, and a styrene block polymer. In such an embodiment, where thefirst protection layer 710 further includes at least one materialselected from the above-described materials, the first protection layer710 may have improved adhesive strength, e.g., an adhesive strength in arange of about 10 gram-force per square inch (gf/in²) to about 50gf/in².

The maximum thickness t1 of the first protection layer 710 may be in arange of about 75 micrometers (μm) to about 100 μm. If the maximumthickness t1 of the first protection layer 710 is less than about 75 μm,it may be difficult to protect the substrate 100 and the display unit200 with the first protection layer 710 alone. If the maximum thicknesst1 of the first protection layer 710 is greater than about 100 μm, thethickness of the display device may be excessively increased, therebycausing an overgrowth.

The second protection layer 720 is a layer formed by curing thephoto-hardening resin coated through the printing process, for example,the Inkjet process. In the process of curing the photo-hardening resin,the second inclination part 721 of the second protection layer 720 maybe tapered toward the substrate 100. The process of forming the secondprotection layer 720 will be described later in greater detail withreference to FIG. 17 and FIG. 18.

In an exemplary embodiment, the second protection layer 720 may beformed using the photo-hardening resin. The photo-hardening resin mayinclude at least one material selected from acrylate-based compoundsincluding acrylate-based polymers, polyurethane and SiO, or may includeany conventional material that forms the photo-hardening resin withoutbeing limited thereto. In one exemplary embodiment, for example, thephoto-hardening resin may further include the photoinitiator, the heatstabilizer, the antioxidant, the antistatic agent, or the slip agent.

In an exemplary embodiment, the photo-hardening resin may furtherinclude at least one material selected from the acryl-based resin, thebutyl rubber, the vinyl acetate resin, the EVA resin, the naturalrubber, the nitriles, the silicate resin, the silicone rubber, and thestyrene block polymer. In such an embodiment, where the photo-hardeningresin further includes at least one material selected form theabove-described materials, the photo-hardening resin may have improvedadhesion. In such an embodiment, the adhesive strength of the secondprotection layer 720 may be in a range of about 10 gf/in² to about 50gf/in².

In such an embodiment, where the second protection layer 720 has apredetermined adhesive strength, it may be easy to adhere a lowerprotective film on the second protection layer 720 in the manufacturingprocess. The lower protective film may effectively prevent an impurityfrom inflowing into the display device or scratches during themanufacturing process.

The second protection layer 720 may include the hardening member of thephoto-hardening resin described above. The second protection layer 720may include an hardening member including at least one material selectedfrom the acrylate-based compounds including an acrylate-based polymer,polyurethane, and SiO. In an exemplary embodiment, the second protectionlayer 720 may further include the photoinitiator, the thermalstabilizer, the antioxidant, the antistatic agent or the slip agent, forexample, remaining in the second protection layer 720 after thephoto-hardening resin is cured.

In an exemplary embodiment, the second protection layer 720 may furtherinclude at least one material selected from the acryl-based resin, thebutyl rubber, the vinyl acetate resin, the EVA resin, the naturalrubber, the nitriles, the silicic acid resin, the silicone rubber, andthe styrene block polymer according to exemplary embodiments. In such anembodiment, where the second protection layer 720 further includes atleast one material selected from the above-described materials, thesecond protection layer 720 may have improved adhesive strength.

According to an exemplary embodiment, by coating and curing thephoto-hardening resin by the printing process (for example, the Inkjetprocess) to form the first protection layer 710 and the secondprotection layer 720, it is easy to form the pattern so that theprotection layers 710 and 720 are not disposed in the bending area BA ofthe substrate 100. In such an embodiment, the protection layers 710 and720 may be easily provided without a separate adhesive layer.

In such an embodiment, by smoothing the inclination of each end of thefirst protection layer 710 and the second protection layer 720, theinterference between the two protection layers 710 and 720 duringbending may be minimized and the stress applied to the substrate 100during bending may be easily adjusted.

Hereinafter, the strain when the substrate 100 is bent will be describedwith reference to FIG. 4 and FIG. 5 along with FIG. 1 to FIG. 3described above. FIG. 4 is a graph showing a strain depending on aninclination angle in a first part P1 and a second part P2 of FIG. 2, andFIG. 5 is a graph showing a strain depending on an inclination angle ina third part P3 and a fourth part P4 of FIG. 2.

In FIG. 4 and FIG. 5, a horizontal axis represents comparative examplesand exemplary embodiments by differentiating the material of theprotection layers 710 and 720 and the inclination angle of theprotection layers 710 and 720, and a vertical axis represents thestrain.

In FIG. 4 and FIG. 5, Comparative Example 1 is a case where theprotection layers 710 and 720 are a PET film in which thephoto-hardening resin are not included, and the inclination angle of theprotection layers 710 and 720 is about 90 degrees. Exemplary Embodiment1, Exemplary Embodiment 2, Exemplary Embodiment 3, Exemplary Embodiment4, Exemplary Embodiment 5, and Comparative Example 2 are each a case inwhich the protection layers 710 and 720 include the photo-hardeningresin. Exemplary Embodiment 1 to Exemplary Embodiment 5, and ComparativeExample 2 are cases in which the inclination angle of the inclinationparts 711 and 721 of the protection layers 710 and 720 are 90 degrees,75 degrees, 60 degrees, 45 degrees, 30 degrees, and 10 degrees,respectively.

Next, FIG. 4 and FIG. 5 will be described with reference to Table 1below. Each value in Table 1 represents the strain in each part of thesubstrate 100. Hereinafter, the strain represents “(strainlength)/(initial length)×100” in each part of the substrate 100, and aunit thereof is %.

In the experimental example of Table 1, the maximum strain capable offunctioning as the display device is set to be 1.4%. That is, when thestrain exceeds 1.4%, the damage may occur in the light-emitting elementsor the wiring, and the stable bending is difficult, which may cause adefect in the display device. In the case of Comparative Example 2 to bedescribed later, for example, the third part P3 receives the strain of1.5%, and thus it may be difficult to be used for a display deviceincluding a bended part.

TABLE 1 Comparative Exemplary Exemplary Exemplary Exemplary ExemplaryComparative Example 1 Embodiment 1 Embodiment 2 Embodiment 3 Embodiment4 Embodiment 5 Example 2 90 degrees 90 degrees 75 degrees 60 degrees 45degrees 30 degrees 10 degrees P1 0.49 0.44 0.33 0.31 0.24 0.29 0.12 P20.56 0.58 0.57 0.57 0.54 0.53 0.4 P3 0.19 0.07 0.16 0.15 0.15 0.06 1.5P4 0.21 0.25 0.29 0.29 0.28 0.22 0.32

The strain applied to the first part P1 and the second part P2 of thesubstrate 100 when bending will hereinafter be described with referenceto FIG. 4.

The first part P1 of the substrate 100 has strain of 0.49%, 0.44%,0.33%, 0.31%, 0.24%, 0.29%, and 0.12% in order of Comparative Example 1,Exemplary Embodiment 1 to Exemplary Embodiment 5, and ComparativeExample 2. That is, the strain applied to the first part P1 decreases inthe order of Comparative Example 1, Exemplary Embodiment 1 to ExemplaryEmbodiment 5, and Comparative Example 2. As described above, when usingthe photo-hardening resin as the protection layers 710 and 720 of therear surface of the substrate 100 (the second surface PL2) as inExemplary Embodiment 1 to Exemplary Embodiment 5 and Comparative Example2, the strain of the first part P1 may be reduced.

The second part P2 of the substrate 100 has strain of 0.56%, 0.58%,0.57%, 0.57%, 0.54%, 0.53%, and 0.40% in the order of ComparativeExample 1, Exemplary Embodiment 1 to Exemplary Embodiment 5, andComparative Example 2. That is, the strain received by the second partP2 generally decreases in the order of Exemplary Embodiment 1 toExemplary Embodiment 5, and Comparative Example 2. As in ExemplaryEmbodiment 1 to Exemplary Embodiment 5 and Comparative Example 2, theprotection layers 710 and 720 of the rear surface of the substrate 100include the photo-hardening resin and the inclination angles θ1 and θ2of the inclination parts 711 and 721 of the protection layers 710 and720 decrease, so the strain of the second part P2 may be reduced.

The difference between the second part P2 and the first part P1 will nowbe described. In Exemplary Embodiment 1, compared with ComparativeExample 1, the strain of the second part P2 is increased from 0.56% to0.58%. However, the second part P2 is the part corresponding to theempty space between two protection layers 710 and 720 disposed on thesecond surface PL2 of the substrate 100, and the increase of the strainmay not affect the light-emitting element, the signal wires, or thelike.

Next, the strain applied to the third part P3 and the fourth part P4 ofthe substrate 100 when the protection layers 710 and 720 have a specificangle will be described with reference to FIG. 5 along with FIG. 6 andFIG. 7. FIG. 6 is a cross-sectional view showing the comparative exampleof FIG. 5, particularly the display device including the first thirdpart P3-1, and FIG. 7 is a cross-sectional view showing the comparativeexample of FIG. 5, particularly the display device including the firstfourth part P4-1.

Referring back to FIG. 5 along with Table 1, the third part P3 of thesubstrate 100 has each strain of 0.19%, 0.07%, 0.16%, 0.15%, 0.15%,0.06%, and 1.5% in the order of Comparative Example 1, ExemplaryEmbodiment 1 to Exemplary Embodiment 5, and Comparative Example 2. Inthe case of Comparative Example 1 and Exemplary Embodiment 1 toExemplary Embodiment 5, the variation of the strain received by thethird part P3 is not substantially great. In contrast, in the case ofComparative Example 2 where the inclination angles θ1 and θ2 of theprotection layers 710 and 720 were about 10 degrees, the strain receivedby the third part P3 increases by 1.5% compared to Comparative Example 1and Exemplary Embodiment 1 to Exemplary Embodiment 5. Hereinafter, thethird part P3 of Comparative Example 2 in FIG. 5 is referred to as afirst third part P3-1.

Next, the bending state of the display device, particularly the firstthird part P3-1 according to Comparative Example 2, will be describedwith reference to FIG. 6. FIG. 6 shows the bending state of the displaydevice in which the second inclination angle θ2 of the second protectionlayer 720 is about 10 degrees. Hereinafter, any repetitive detaileddescription of the same or like constituent elements as the constituentelements described above with reference to FIG. 1 to FIG. 3 will beomitted.

Referring to FIG. 6, as the strain received by the first third part P3-1of the substrate 100 is rapidly increased to 1.5% as shown in FIG. 5,the substrate 100 may be struck down compared to the case shown in FIG.2 around first third part P3-1. That is, when the second inclinationangle θ2 of the second protection layer 720 is about 10 degrees, thesecond flat area F2 may not be maintained in a flat shape and may belower in the z-axis direction than the horizontal position of theflexible circuit board 800. The bending area BA part adjacent to thesecond flat area F2 may also be struck down along with the second flatarea F2.

In an exemplary embodiment of the display device of FIG. 2, both thefirst flat area F1 and the second flat area F2 may be effectivelymaintained in the flat state, thereby ensuring the stability even whenthe display device is bent.

In FIG. 6, the case where the second inclination angle θ2 of secondprotection layer 720 is about 10 degree is shown to show the shape ofthe bending state of the first third part P3-1, and the firstinclination angle θ1 of the first protection layer 710 may be greaterthan about 10 degrees.

Referring back to FIG. 5 along with Table 1, the fourth part P4 of thesubstrate 100 has strain of 0.21%, 0.25%, 0.29%, 0.29%, 0.28%, 0.22%,and 0.32% in the order of Comparative Example 1, Exemplary Embodiment 1to Exemplary Embodiment 5, and Comparative Example 2. In the case ofComparative Example 1 and Exemplary Embodiment 1 to Exemplary Embodiment5, the variation of the strain received by the fourth part P4 is notsubstantially. In contrast, in the case of Comparative Example 2 wherethe inclination angles θ1 and θ2 of the protection layers 710 and 720are about 10 degrees, the strain received by the fourth part P4 israther increased to 0.32% compared with Comparative Example 1 andExemplary Embodiment 1 to Exemplary Embodiment 5. Hereinafter, thefourth part P4 of Comparative Example 2 in FIG. 5 is referred to as thefirst fourth part P4-1.

Hereinafter, referring to FIG. 7, the bending state of the displaydevice according to Comparative Example 2, particularly the first fourthpart P4-1, will be described. FIG. 7 shows the bending state of thedisplay device, in which the first inclination angle θ1 of the firstprotection layer 710 is about 10 degrees. Hereinafter, any repetitivedetailed description of the same or like constituent elements as theconstituent elements described above with reference to FIG. 1 to FIG. 3will be omitted.

Referring to FIG. 7, as the strain received by the first fourth partP4-1 of the substrate 100 is increased to 0.32% as shown in FIG. 5, thesubstrate 100 may rise up near the first fourth part P4-1, compared tothe case shown in FIG. 2. That is, when the first inclination angle θ1of the first protection layer 710 is about 10 degrees, the first fourthpart P4-1 of the substrate 100 may rise in the z-axis direction morethan the horizontal position of the substrate 100 where the display unit200 and the polarization layer 400 are disposed. That is, the first flatarea F1 may not be maintained in the flat shape and may swing up in thez-axis direction in the part adjacent to the bending area BA. The partof the bending area BA adjacent to the second flat area F2 may swing upin the z-axis direction along with the second flat area F2.

In an exemplary embodiment of the display device of FIG. 2, both thefirst flat area F1 and the second flat area F2 are effectivelymaintained in the flat state, so that the display device may ensurestability even in the bending state.

In FIG. 7, the case where the first inclination angle θ1 of the firstprotection layer 710 is about 10 degrees is shown to show the shape inthe bending state of the first fourth part P4-1, and the secondinclination angle θ2 of the second protection layer 720 may be greaterthan about 10 degrees.

Although FIG. 6 and FIG. 7 are illustrated as separate comparativeexamples, when both the first inclination angle θ1 and the secondinclination angle θ2 are about 10 degrees, FIG. 6 and FIG. 7 may becombined. That is, the first third part P3-1 of the substrate 100 mayhave the form shown in FIG. 6, and the first fourth part P4-1 of thesubstrate 100 may have the form shown in FIG. 7.

Referring back to FIG. 4 and FIG. 5 along with Table 1 described above,the strain of comparative examples and exemplary embodiments in Table 1will hereinafter be summarized.

In Comparative Example 1, the first, second, third, and fourth parts P1,P2, P3, and P4 have the strain of 0.49%, 0.56%, 0.19%, and 0.21%,respectively. In Exemplary Embodiment 1, the first, second, third, andfourth parts P1, P2, P3, and P4 have the strain of 0.44%, 0.58%, 0.07%,and 0.25%, respectively. In Exemplary Embodiment 4, the first, second,third, and fourth parts P1, P2, P3, and P4 have the strain of 0.24%,0.54%, 0.15%, and 0.28%, respectively. In Exemplary Embodiment 5, thefirst, second, third, and fourth parts P1, P2, P3, and P4 have thestrain of 0.29%, 0.53%, 0.06%, and 0.22%.

In Exemplary Embodiment 1, even though the inclination angles θ1 and θ2are about 90 degrees, since the protection layers 710 and 720 includethe photo-hardening resins, the strain of the first part P1 and thethird part P3 is reduced, which enables more stable bending thanComparative Example 1.

In Exemplary Embodiment 2 to Exemplary Embodiment 5, compared toComparative Example 1, the strain received by the substrate 100 issubstantially reduced, thereby effectively bending. Particularly, in thecase of Exemplary Embodiment 4 (45 degrees) and Exemplary Embodiment 5(30 degrees), the strain received by each part P1, P2, P3, and P4 of thesubstrate 100 is significantly reduced in comparison with ComparativeExample 1.

In Comparative Example 2, the first, second, third, and fourth parts P1,P2, P3, and P4 have the strain of 0.12%, 0.40%, 1.5%, and 0.32%,respectively. The strain of the fourth part P4 is increased compared toComparative Example 1, and the strain of the third part P3 exceeds themaximum strain (1.4%). In other words, if the inclination angles θ1 andθ2 become abruptly smooth at about 10 degrees, the strain becomes ratherlarge.

Accordingly, in an exemplary embodiment, the first inclination angle θ1and the second inclination angle θ2 may be greater than about 10 degreesor less than about 90 degrees, for example, about 30 degrees or greaterto about 45 degrees or less.

When the protection layers 710 and 720 on the rear surface of thesubstrate 100 include the photo-hardening resin, as the inclinationangles θ1 and θ2 of the protection layers 710 and 720 decreases, thestrain received by the substrate 100 is reduced. Also, the variationreceived by the light-emitting element, the wiring, and the like of thedisplay unit 200 disposed on the substrate 100 or the thin filmtransistor disposed in the non-display unit is reduced, therebyeffectively preventing the damage thereof due to the strain of thesubstrate 100 by bending. That is, as the inclination of the protectionlayers 710 and 720 decreases, the strain of the substrate 100 decreasesand the bending may be stably performed without damaging the displaydevice.

However, when the inclination angles θ1 and θ2 of the protection layers710 and 720 rapidly decrease by about 10 degrees (Comparative Example2), the strains of the substrate 100, particularly the third part P3 andthe fourth part P4 of the substrate 100, do not decrease, but ratherincrease, and as a result, the deformation of the substrate 100 issevere. As shown in Comparative Example 2, the strain of the third-firstpart P3-1 rapidly increases to 1.5% and the strain of the fourth-firstpart P4-1 also increases to 0.32%.

Therefore, in an exemplary embodiment, the inclination angles θ1 and θ2of the protection layers 710 and 720 may be greater than about 10degrees or less than about 90 degrees, for example, about 30 degrees orgreater to 45 degrees or less.

According to an exemplary embodiment of the display device, as describedabove, by forming the end of the protection layers 710 and 720 of thesubstrate 100 rear surface to be inclined, the interference in thebending area BA may be minimized by facilitating the space clearancesecurity in the bending area BA.

According to an exemplary embodiment, by adjusting the inclinationangles θ1 and θ2 of the ends of the protection layers 710 and 720, thestress received by the bending area BA may be effectively controlled andthe bending may be stable. In such an embodiment, as the slopes of theends of the protection layers 710 and 720 are smoothed, the stressapplied to the substrate 100 may be reduced during bending, and thestrain may be reduced, thereby enabling the stable bending.

Next, alternative exemplary embodiments of the display device will bedescribed with reference to FIG. 8 to FIG. 15. Hereinafter, anyrepetitive detailed description of similar or same constituent elementsas the constituent elements described above with reference to FIG. 1 toFIG. 3 will be omitted.

Hereinafter, an exemplary embodiment of the display device, in which analignment of the protection layer is modified, will be described withreference to FIG. 8. FIG. 8 is a schematic cross-sectional view of adisplay device according to an alternative exemplary embodiment.

Referring to FIG. 8, in an exemplary embodiment, the first inclinationpart 711 of the first protection layer 710 meets the substrate 100 atthe first contact point Q1. In such an embodiment, the edge of the firstprotection layer 710 is disposed at the first contact point Q1. In suchan embodiment, the edge of the first protection layer 710 maysubstantially coincide with the edge of the display unit 200 and thepolarization layer 400. In such an embodiment, as shown in FIG. 8, thefirst contact point Q1 and the edge of the display unit 200 and thepolarization layer 400 may be disposed on a same imaginary straight line13 in a z-axis direction.

When the first protection layer 710 is formed through the printingprocess, the alignment of the first protection layer 710 may be easilycontrolled, thereby aligning the edge of the first protection layer 710and the edge of the display unit 200. In an embodiment where the edge ofthe first protection layer 710 is aligned substantially in a same lineas the edge of the display unit 200, an area occupied by a dead space ora bezel may be reduced.

Next, another alternative exemplary embodiment of the display device inwhich the protection layer has a multi-layered structure will bedescribed with reference to FIG. 9 and FIG. 10. FIG. 9 is a schematiccross-sectional view of a display device according to anotheralternative exemplary embodiment, and FIG. 10 is a schematiccross-sectional view showing a state in which a substrate is unfolded ina display device according to an exemplary embodiment of FIG. 9.

Referring to FIG. 9 and FIG. 10, in an exemplary embodiment, at leastone of the first protection layer 710 and the second protection layer720 may include a plurality of layers. In one exemplary embodiment, forexample, the first and second protection layers (710 and 720) mayinclude a first auxiliary layer (710 a and 720 a), a second auxiliarylayer (710 b and 720 b), and a third auxiliary layer (710 c and 720 c),respectively. In an embodiment, as shown in FIG. 9, the first protectionlayer 710 and the second protection layer 720 respectively include thefirst auxiliary layer (710 a and 720 a), the second auxiliary layer (710b and 720 b), and the third auxiliary layer (710 c and 720 c), but notbeing limited thereto. Alternatively, and only one of the firstprotection layer 710 and the second protection layer 720 may have amulti-layered structure.

Each of the first auxiliary layers 710 a and 720 a, the second auxiliarylayers 710 b and 720 b, and the third auxiliary layers 710 c and 720 cmay be formed through a separate printing process (for example, anInkjet process).

The first auxiliary layers 710 a and 720 a, the second auxiliary layers710 b and 720 b, and the third auxiliary layers 710 c and 720 c mayinclude the hardening member of the photo-hardening resin, respectively.The hardening members of the photo-hardening resin may independentlyinclude photoinitiators, thermal stabilizers, antioxidants, antistaticagents or slip agents, for example.

Ends of the first auxiliary layer 710 a, the second auxiliary layer 710b, and the third auxiliary layer 710 c collectively define or form thefirst inclination part 711 of the first protection layer 710. Ends ofthe first auxiliary layer 720 a, the second auxiliary layer 720 b, andthe third auxiliary layer 720 c collectively define or form the secondinclination part 721 of the second protection layer 720. The firstinclination part 711 and the second inclination part 721 may have ashape inclined toward the back of the substrate 100, that is, the secondsurface PL2.

In an exemplary embodiment, the end of the first auxiliary layers 710 aand 720 a may have a shape covered by the end of the second auxiliarylayers 710 b and 720 b and the third auxiliary layers 710 c and 720 c,and the end of the second auxiliary layer 710 b and 720 b may have ashape covered by the end of the third auxiliary layers 710 c and 720 c.In such an embodiment, the first auxiliary layers 710 a and 720 a, thesecond auxiliary layers 710 b and 720 b, and the third auxiliary layers710 c and 720 c may be sequentially stacked.

The first inclination part 711 forms the edge at the first contact pointQ1 disposed at the second surface PL2 of the substrate 100. That is, thefirst protection layer 710 meets the second surface PL2 of the substrate100 at the first contact point Q1. The end adjacent to the bending areaBA of the first protection layer 710 has the first inclination part 711having the first inclination angle θ1. The first inclination angle θ1 isthe angle that the first protection layer 710 forms with the substrate100 at the first contact point Q1. The first inclination angle θ1 has avalue that is greater than about 10 degrees and less than about 90degrees. In one exemplary embodiment, for example, the first inclinationangle θ1 may be about 30 degrees or greater to about 90 degrees or less.

The second inclination part 721 forms the edge at the second contactpoint Q2 disposed at the second surface PL2 of the substrate 100. Thatis, the second protection layer 720 meets the second surface PL2 of thesubstrate 100 at the second contact point Q2. The end adjacent to thebending area BA of the second protection layer 720 has the secondinclination part 721 having the second inclination angle θ2. The secondinclination angle θ2 is an angle between the second protection layer 720and the substrate 100 at the second contact point Q2. The secondinclination angle θ2 has a value of more than 10 degrees and less than90 degrees. In one exemplary embodiment, for example, the secondinclination angle θ2 may be 30 degrees or greater to 90 degrees or less.

The ends of the first auxiliary layers 710 a and 720 a, the secondauxiliary layers 710 b and 720 b, and the third auxiliary layers 710 cand 720 c constituting the first inclination part 711 and the secondinclination part 721 may have a smooth cross-section.

The first auxiliary layers 710 a and 720 a may be in contact with thesecond surface PL2 of the substrate 100.

The maximum thickness ta of the first auxiliary layers 710 a and 720 amay be in a range of about 5 μm to about 20 μm. If the maximum thicknessta of the first auxiliary layers 710 a and 720 a is less than about 5μm, it may be difficult to provide the desired or effective level ofadherence, and if the maximum thickness ta of the first auxiliary layers710 a and 720 a is greater than about 20 μm, the thickness occupied bythe protection layers 710 and 720 may increase.

The first auxiliary layers 710 a and 720 a may include at least onematerial selected from an acryl-based resin, butyl rubber, a vinylacetate resin, an EVA resin, a natural rubber, nitriles, a silicateresin, a silicone rubber, and a styrene block polymer. The firstauxiliary layers 710 a and 720 a may provide adherence for couplingbetween the substrate 100 and the first protection layer 710 and betweenthe substrate 100 and the second protection layer 720.

The second auxiliary layers 710 b and 720 b are disposed between thefirst auxiliary layers 710 a and 720 a and the third auxiliary layers710 c and 720 c.

The maximum thickness tb of the second auxiliary layers 710 b and 720 bmay be in a range of about 45 μm to about 80 μm. If the maximumthickness tb of the second auxiliary layers 710 b and 720 b is less thanabout 45 μm, the first protection layer 710 and the second protectionlayer 720 have a difficulty in performing a function of protecting thesubstrate 100 or the display unit 200. If the maximum thickness tb ofthe second auxiliary layers 710 b and 720 b is greater than about 80 μm,the thickness occupied by the first protection layer 710 and the secondprotection layer 720 may be excessively great.

The second auxiliary layers 710 b and 720 b may include at least onematerial selected from the acrylate-based compounds including anacrylate-based polymer, polyurethane, and SiO. The second auxiliarylayers 710 b and 720 b may enable the first protection layer 710 and thesecond protection layer 720 to have predetermined elasticity.

The thickness of the second auxiliary layers 710 b and 720 b may begreater than the thickness of the first auxiliary layers 710 a and 720 aand the third auxiliary layers 710 c and 720 c. The second auxiliarylayers 710 b and 720 b may protect the substrate 100 or the display unit200 from impurity.

The third auxiliary layers 710 c and 720 c are disposed above the secondauxiliary layers 710 b and 720 b. The third auxiliary layers 710 c and720 c are auxiliary layers disposed furthest from the second surface PL2of the substrate 100.

The third auxiliary layers 710 c and 720 c include a heat dissipatingmaterial. The heat dissipating material may be a carbon compositematerial including at least one material selected from graphite, carbonnanotube (“CNT”), carbon fiber, and graphene. Graphite has desiredcharacteristics such as high thermal conductivity and dispersibility,and low cost. Carbon nanotube has high electric conductivity, and highthermal conductivity may be obtained even by adding a small amount dueto a large aspect ratio thereof.

The third auxiliary layers 710 c and 720 c as the heat dissipatingmaterial may include at least one material selected from a carboncomposite material, a metal composite material including metalparticles, and a ceramic composite material including a ceramic powder.

The metal composite material may include metal particles and polymers.The metal particles function to improve thermal conductivity. The metalparticles may be any one of Al, Ag, Cu, and Ni, but not being limitedthereto.

The ceramic composite material may include a ceramic powder and apolymer. The ceramic powder has heat conductivity, thereby performing aheat dissipating function. The ceramic powder may be any one of AlN,Al₂O₃, BN, SiC, and BeO, but not being limited thereto.

The heat dissipating material included in the third auxiliary layers 710c and 720 c is not limited to the above-described materials.

The third auxiliary layers 710 c and 720 c may further include adispersant. The dispersant allows the material included the thirdauxiliary layer (710 c and 720 c) to be present in a form of a powder.The dispersant may be a photo-hardening resin for dispersing. Thedispersion photo-hardening resin may deteriorate the heat dissipatingeffect by acting as particles or impurities when carbon is aggregatedtogether. Therefore, the dispersant may be added to distribute theparticles independently, thereby maximizing the heat dissipating effect.According to an exemplary embodiment, the heat dissipating materialitself may also function as the dispersant.

In an exemplary embodiment of the display device, the light-emittingelement or the circuit board 800 generates heat during the operation todrive the display device. When the display device is used under amaximum load or for a long time, excessive heat generation may causeoverheating of the electronic components of the display device, suchthat the display device may malfunction and be damaged. Accordingly, inan exemplary embodiment, the third auxiliary layers 710 c and 720 c maydissipate heat generated from the display device by including the heatdissipating material, and maximize the heat dissipating effect byfurther including the dispersant.

The maximum thickness tc of the third auxiliary layer (710 c and 720 c)may be in a range of about 10 μm to about 30 μm. If the maximumthickness tc of the third auxiliary layers 710 c and 720 c is less thanabout 10 μm, it may be difficult to perform the function of protectingthe other auxiliary layers, and if the maximum thickness tc of the thirdauxiliary layers 710 c and 720 c is greater than about 30 μm, thethickness of the first protection layer 710 and the second protectionlayer 720 may be excessively great.

Next, another alternative exemplary embodiment the display device willbe described with reference to FIG. 11. FIG. 11 is a schematiccross-sectional view of a display device according to anotheralternative exemplary embodiment. Specifically, FIG. 11 shows anexemplary embodiment in which the protection layer has a multi-layeredstructure and the alignment of each auxiliary layer is modified.

Referring to FIG. 11, each end of the first auxiliary layers 710 a and720 a, the second auxiliary layers 710 b and 720 b, and the thirdauxiliary layers 710 c and 720 c may be different from that shown inFIG. 10.

The end of the first auxiliary layers 710 a and 720 a may be exposed bythe second auxiliary layers 710 b and 720 b and the third auxiliarylayers 710 c and 720 c, and the end of the second auxiliary layers 710 band 720 b may be exposed by the third auxiliary layers 710 c and 720 c.

The end of the first auxiliary layers 710 a and 720 a, the secondauxiliary layers 710 b and 720 b, and the third auxiliary layers 710 cand 720 c may have a smooth step shape, for example. In such anembodiment, the ends of the first auxiliary layer 710 a and 720 a, thesecond auxiliary layer 710 b and 720 b, and the third auxiliary layer710 c and 720 c may not be aligned with each other. Each end of thefirst auxiliary layers 710 a and 720 a, the second auxiliary layers 710b and 720 b, and the third auxiliary layers 710 c and 720 c may bedisposed far from the bending area in the order of the first auxiliarylayers 710 a and 720 a, the second auxiliary layers 710 b and 720 b, andthe third auxiliary layers 710 c and 720 c.

Next, an exemplary embodiment in which the protection layer is formed inthe bending area BA will be described with reference to FIG. 12 to FIG.15. FIG. 12 is a schematic cross-sectional view of a display deviceaccording to another alternative exemplary embodiment, FIG. 13 is across-sectional view showing a state in which a substrate is folded in adisplay device according to an exemplary embodiment of FIG. 12, FIG. 14is a schematic cross-sectional view of a display device according toanother alternative exemplary embodiment, and FIG. 15 is a schematiccross-sectional view of a display device according to anotheralternative exemplary embodiment.

In an exemplary embodiment, referring to FIG. 12 and FIG. 13, the secondauxiliary layer 710 b included in the first protection layer 710 and thesecond auxiliary layer 720 b included in the second protection layer 720may be connected to each other. The connected part is referred to as asecond connection part 715 b, and the second connection part 715 b maybe disposed on the second surface PL2 of the substrate 100 at thebending area BA. The second auxiliary layer 710 b included in the firstprotection layer 710, the second connection part 715 b, and the secondauxiliary layer 720 b included in the second protection layer 720 may beintegrally formed as a single unitary unit, thereby forming a samelayer. In such an embodiment, the second connection part 715 b includesa same material as the second auxiliary layers 710 b and 720 b. Thesecond auxiliary layers 710 b and 720 b and the second connection part715 b may be formed during a same process.

Referring to FIG. 13, by disposing the second connection part 715 b inthe bending area BA to provide elasticity to the substrate 100 duringthe bending of the display device, the bending may be flexible and thedamage to the display device may be effectively prevented. In addition,the inflow of impurities to the substrate 100 may be effectivelyprevented.

FIG. 12 and FIG. 13 show an exemplary embodiment including the secondconnection part 715 b integrally formed as a single unitary unit withthe second auxiliary layers 710 b and 720 b. According to an exemplaryembodiment, as shown in FIG. 14 and FIG. 15 to be described, theconnection part including at least one of a first connection part 715 aand a third connection part 715 c may be disposed at the bending areaBA.

Referring to FIG. 14, in an alternative exemplary embodiment, the firstauxiliary layer 710 a included in the first protection layer 710 and thefirst auxiliary layer 720 a included in the second protection layer 720may be connected to each other. The connected part is referred to as thefirst connection part 715 a, and the first connection part 715 a may bedisposed on the second surface PL2 of the substrate 100 in the bendingarea BA. The first auxiliary layer 710 a included in the firstprotection layer 710 and the first auxiliary layer 720 a included in thesecond protection layer 720 may be integrally formed as a single unitaryunit, thereby forming a same layer. In such an embodiment, the firstconnection part 715 a includes the same material as the first auxiliarylayers 710 a and 720 a. The first auxiliary layers 710 a and 720 a andthe first connection part 715 a may be formed in a same process.

Referring to FIG. 15, the third auxiliary layer 710 c included in thefirst protection layer 710 and the third auxiliary layer 720 c includedin the second protection layer 720 may be connected to each other. Theconnected part is referred to as the third connection part 715 c, andthe third connection part 715 c may be disposed on the second surfacePL2 of the substrate 100 in the bending area BA. The third auxiliarylayer 710 c included in the first protection layer 710 and the thirdauxiliary layer 720 c included in the second protection layer 720 may beintegrally formed as a single unitary unit, thereby forming a samelayer. That is, the third connection part 715 c includes a same materialas the third auxiliary layers 710 c and 720 c. The third auxiliarylayers 710 c and 720 c and the third connection part 715 c may be formedin a same process.

According to an exemplary embodiment, as shown in FIG. 12 to FIG. 15,the connection part including at least one material selected from thefirst connection part 715 a, the second connection part 715 b, and thethird connection part 715 c may be disposed in the bending area BA. Theconnection part disposed in the bending area BA may have a singlelayered or multi-layered structure. In such an embodiment, at least oneauxiliary layer is disposed in the bending area BA to prevent the inflowof the impurity to the substrate 100.

Next, the thin film transistor and the light-emitting element includedin the display unit 200 are described with reference to FIG. 16. FIG. 16is a cross-sectional view of a thin film transistor and a light-emittingelement of a display unit according to an exemplary embodiment.

Referring to FIG. 16, in an exemplary embodiment of a display unit 200,a buffer layer 111 is disposed on the substrate 100. The buffer layer111 may overlap an entire surface of the substrate 100. The buffer layer111 may include an inorganic material such as a silicon oxide (SiOx), asilicon nitride (SiNx), or the like. The buffer layer 111 may be definedby a single layer or a plurality of layers.

The buffer layer 111 may provide a flat surface on one surface of thesubstrate 110 to planarize, and may effectively prevent an impuritydegrading the characteristics of a later-described semiconductor layer151 from being diffused and the penetration of moisture, etc. Accordingto an alternative exemplary embodiment, the buffer layer 111 may beomitted.

The semiconductor layer 151 of the thin film transistor TFT is disposedon the buffer layer 111. The semiconductor layer 151 includes a channelarea 154, and a source area 153 and a drain area 155 disposed atrespective sides of the channel area 154.

The semiconductor layer 151 may include a polysilicon, an amorphoussilicon, or an oxide semiconductor.

A gate insulating layer 140 is disposed on the semiconductor layer 151.The gate insulating layer 140 may be disposed to overlap the entiresurface of the substrate 100.

The gate insulating layer 140 may include an inorganic insulatingmaterial such as a silicon oxide (SiOx), a silicon nitride (SiNx), orthe like.

A gate conductor including a gate electrode 124 of the thin filmtransistor is disposed on the gate insulating layer 140. The gateelectrode 124 may overlap the channel area 154 of the semiconductorlayer 151.

An interlayer insulating layer 160 including the inorganic insulatingmaterial or the organic insulating material is disposed on the gateelectrode 124.

In such an embodiment, a data conductor including a source electrode 173and a drain electrode 175 of the thin film transistor TFT, a data line171, a driving voltage line (not shown), etc., is disposed on theinterlayer insulating layer 160. The source electrode 173 and the drainelectrode 175 may be respectively connected to the source area 153 andthe drain area 155 of the semiconductor layer 151 through contact holes163 and 165 defined through the interlayer insulating layer 160 and thegate insulating layer 140.

The gate electrode 124, the source electrode 173, and the drainelectrode 175 form the thin film transistor TFT together with thesemiconductor layer 151. The thin film transistor TFT shown in FIG. 16may be a driving transistor included in one pixel of an emissive displaydevice. In an exemplary embodiment, as shown in FIG. 16, the thin filmtransistor TFT may be a top-gate transistor, in which the gate electrode124 is disposed above the semiconductor layer 151. However, thestructure of the thin film transistor TFT is not limited thereto and maybe variously modified, and for example, the thin film transistor TFT maybe a bottom-gate transistor in which the gate electrode is positionedunder the semiconductor

A planarization layer 180 is disposed on the interlayer insulating layer160 and the data conductor. The planarization layer 180 serves to removeand planarize a step in order to increase emission efficiency of anorganic light-emitting element (“OLEO”) to be formed thereon. Theplanarization layer 180 may overlap and cover the thin film transistorTFT.

A pixel electrode 191 is disposed on the planarization layer 180. Thepixel electrode 191 may be connected to the drain electrode 175 of thethin film transistor TFT through a contact hole 185 defined through theplanarization layer 180.

A partition wall 360 is disposed on the planarization layer 180 and thepixel electrode 191. The partition wall 360 may overlap the part of thepixel electrode 191, and an opening 361 is defined through the partitionwall 360 to expose a part of the pixel electrode 191.

The partition wall 360 may include an organic insulating materials suchas a polyimide, a polyacrylate, and a polyamide, but not being limitedthereto.

An emission layer 370 is disposed on the pixel electrode 191. Theemission layer 370 includes an emission area. The emission layer 370 mayadditionally include at least one area selected from a hole injectionarea, a hole transport area, an electron injection area, and an electrontransport area.

The emission layer 370 may include an organic material that emits lightof a primary color such as red, green, and blue. In an exemplaryembodiment, the emission layer 370 may have a structure in which aplurality of organic materials emitting different colors of light arestacked. In such an embodiment, inorganic materials for emitting lightsuch as red, green, and blue light may be included.

A common electrode 270 for transmitting a common voltage is disposed onthe emission layer 370 and the partition wall 360.

The pixel electrode 191, the emission layer 370, and the commonelectrode 270 of each pixel form the light-emitting element of the OLED.In an exemplary embodiment, the pixel electrode 191 may be an anode,which is a hole injection electrode, and the common electrode 270 may bea cathode, which is an electron injection electrode. Alternatively, thepixel electrode 191 may be the cathode and the common electrode 270 maybe the anode. Light is emitted when holes and electrons from the pixelelectrode 191 and the common electrode 270 are injected into the lightemission layer 370 and then excitons of which the injected holes andelectrons are combined fall from an excited state to a ground state.

An encapsulation layer 390 may be disposed on the common electrode 270.The encapsulation layer 390 may include a plurality of inorganic layers,or has a structure in which an inorganic layer and an organic layer arealternately stacked.

According to an exemplary embodiment of the display device, in theprotection layers 710 and 720, as the above-described third auxiliarylayers 710 c and 720 c (referring to FIG. 9) include the heatdissipating material, the heat generated from the light-emitting elementor the transistor may be dissipated to prevent damage to the displaydevice.

Next, an exemplary embodiment of a manufacturing method of the displaydevice will be described with reference to FIG. 17 and FIG. 18. FIG. 17is a schematic top plan view showing a manufacturing method of a displaydevice according to an exemplary embodiment, and FIG. 18 is a schematiccross-sectional view showing a manufacturing method of a display deviceaccording to an exemplary embodiment.

Referring to FIG. 17 and FIG. 18, a top view of a printing device 10 andthe substrate 100 viewed from the z-axis direction is shown. In FIG. 17,the visible portion of the substrate 100 is the back surface of thesubstrate 100, that is, the second surface PL2. Referring to FIG. 18,the printing device 10 and the substrate 100 are provided to be spacedat a predetermined interval in the z axis direction.

The printing device 10 coats a photo-hardening resin solution whilepassing the substrate 100 in the order of the first flat area F1, thebending area BA, and the second flat area F2. The coated photo-hardeningresin solution is then cured with light (e.g., ultraviolet rays) to formthe protection layers 710 and 720 on the second surface PL2 of thesubstrate 100. According to an exemplary embodiment, the printing device10 may coat the photo-hardening resin solution while passing thesubstrate 100 in the order of the second flat area F2, the bending areaBA, and the first flat area F1.

The printing device 10 include a head 11 and a nozzle 12 disposed underthe head 11. The nozzle 12 may be a multi-nozzle including at least twonozzles having different sizes from each other. In one exemplaryembodiment, for example, the nozzle 12 may include a first nozzle 12 aand a second nozzle 12 b having different sizes from each other.

Although not shown, the printing device 10 may further include areservoir for storing the photo-hardening resin solution and connectedto the nozzle 12.

In FIG. 17, one position of the first flat area F1 of the substrate 100is referred to as a position X1. The position on the right other thanthe position X1 in the y-axis direction, that is, closer to the bendingarea BA, is referred to as a position X2. FIG. 18 shows a shape in whichthe printing device 10 performs the printing process at the position X1and the position X2. Hereinafter, any repetitive detailed description ofthe same and similar constituent elements as the constituent elementsdescribed above with reference to FIG. 1 to FIG. 3 will be omitted.

Referring to FIG. 18, the printing device 10 sequentially coats thephoto-hardening resin while moving from the position X1 to the positionX2. The nozzle 12 of the printing device 10 may discharge droplets ofthe photo-hardening resin. The printing device 10 may discharge firstdroplets L1 to the second surface PL2 of the substrate 100 through thenozzle 12 at the position X1, and may discharge second droplets L2 tothe second surface PL2 of the substrate 100 through the nozzle 12 at theposition X2.

In such an embodiment, the nozzle 12 for discharging the first dropletsL1 at the position X1 may be the first nozzle 12 a, and the nozzle 12for discharging the second droplets L2 at the position X2 may be thesecond nozzle 12 b. Here, the size of the first nozzle 12 a may belarger than the size of the second nozzle 12 b, and the volume of thefirst droplets L1 may be larger than the volume of the second dropletsL2. In such an embodiment, the first nozzle 12 a may discharge dropletsof a greater amount than the second nozzle 12 b.

Accordingly, the first protection layer 710 is formed with a thinnerthickness from the first flat area F1 toward the bending area BA,thereby forming the first inclination part 711. In such an embodiment,the first droplets L1 and the second droplets L2 that are discharged tothe substrate 100 are combined and then form the first inclination part711 while flowing to the bending area BA side.

According to an alternative exemplary embodiment, the sizes of the firstnozzle 12 a and the second nozzle 12 b may be substantially the same aseach other, but a number of the first nozzles 12 a may be greater thanthat of second nozzles 12 b to adjust the amount of the dischargeddroplets.

The first inclination part 711 of the first protection layer 710 formedthrough the above process has the first inclination angle θ1 with thesubstrate 100 at the first contact point Q1 that meets the secondsurface PL2 of the substrate 100. The first inclination angle θ1 has avalue that is greater than about 10 degrees and less than about 90degrees, for example, about 30 degrees or greater and about 45 degreesor less.

Although not shown separately, the printing device 10 may form thesecond protection layer 720 by an Inkjet process as the first protectionlayer 710. Even in the second flat area F2, the amount of the dischargeddroplet is lower when the printing device 10 is disposed at the sideclose to the bending area BA. Accordingly, the second protection layer720 may have a thinner thickness from the second flat area F2 toward thebending area BA to form the second inclination part 721. In such anembodiment, the droplets discharged at each position of the second flatarea F2 are combined with each other and flow toward the bending area BAto form the second inclination part 721.

The second inclination part 721 of the second protection layer 720formed by the process has the second inclination angle θ2 with thesubstrate 100 at the second contact point Q2 that meets the secondsurface PL2 of the substrate 100. The second inclination angle θ2 has avalue that is greater than about 10 degrees (°) and about 90 degrees orless, and may be, for example, about 30 degrees or greater and about 45degrees or less

Referring to FIG. 18, an upper protection film (not shown) may beattached on the substrate 100 on which the display unit 200 and thepolarization layer 400 are disposed. After coating and curing thephoto-hardening resin on the second surface PL2 of the substrate 100 toform the protection layers 710 and 720, the upper protection film (notshown) may be removed to provide the display device.

As described above, according to an exemplary embodiment of themanufacturing method (for example, the Inkjet process) of the displaydevice, the inclination degree of the end of the protection layers 710and 720 may be easily controlled by adjusting the amount of droplets ofthe photo-hardening resin discharged to the substrate 100 through theprinting device 10. Accordingly, the bending may be facilitated byreducing the strain received by the substrate during bending andminimizing the interference between the protection layers 710 and 720.

In such an embodiment, the first protection layer 710 and the secondprotection layer 720 is formed by coating and curing the photo-hardeningresin through the printing process (for example, the Inkjet process),selective patterning may be effectively performed, and accordingly, themanufacturing cost may be reduced and the process may be simplified.

While the invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments. On the contrary, it is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

What is claimed is:
 1. A manufacturing method of a display devicecomprising: providing a display unit including a plurality of thin filmtransistor on a surface of a substrate; and coating and curing aphoto-hardening resin on an opposing surface of the substrate, which isopposite to the surface of the substrate, to form a first protectionlayer and a second protection layer, wherein the photo-hardening resinis coated through an Inkjet process.
 2. The manufacturing method ofclaim 1, wherein the coating of the photo-hardening resin includescoating the photo-hardening resin by a printing device including anozzle, the nozzle discharges droplets of the photo-hardening resin, thedisplay device includes a first flat area in which the display unit isprovided, a bending area adjacent to the first flat area, and a secondflat area adjacent to the bending area, and the nozzle discharges fewerdroplets of the photo-hardening resin from the first flat area towardthe bending area and discharges fewer droplets of the photo-hardeningresin from the second flat area toward the bending area.
 3. Themanufacturing method of claim 1, Wherein the substrate including a firstflat area, a second flat area, and a bending area disposed between thefirst flat area and the second flat area; the first protection layeroverlaps the first flat area; and the second protection layer overlapsthe second flat area.
 4. The manufacturing method of claim 1, whereinthe first protection layer includes a first inclination part at an endthereof, the second protection layer includes a second inclination partat an end thereof, the first inclination part has a first inclinationangle with the opposing surface of the substrate, the second inclinationpart has a second inclination angle with the opposing surface of thesubstrate, and each of the first inclination angle and the secondinclination angle is greater than or equal to about 10 degrees and lessthan or equal to about 90 degrees.
 5. The manufacturing method of claim4, wherein the first inclination angle and the second inclination angleare in a range of about 30 degrees to about 45 degrees.
 6. Themanufacturing method of claim 4, wherein as the first inclination angleand the second inclination angle decrease, a strain received by thesubstrate at the bending area decreases.
 7. The manufacturing method ofclaim 6, wherein a maximum value of the strain on one part of thesubstrate is about 1.4% during bending of the display device, and avalue of the strain is defined as: (strain length)/(initiallength)×100(%).
 8. The manufacturing method of claim 4, the firstinclination part is formed at a part where the first flat area isadjacent to the bending area, and the second inclination part is formedat a part where the second flat area is adjacent to the bending area. 9.The manufacturing method of claim 1, wherein the photo-hardening resinincludes at least one material selected from an acrylate-based compoundincluding an acrylate-based polymer, a polyurethane, and SiO; and thephoto-hardening resin further includes at least one material selectedfrom an acryl-based resin, a butyl rubber, a vinyl acetate resin, anethylene vinyl acetate resin, a natural rubber, nitriles, a silicateresin, a silicone rubber and a styrene block polymer.
 10. Themanufacturing method of claim 1, wherein each of the first protectionlayer and the second protection layer includes a first auxiliary layer,a second auxiliary layer and a third auxiliary layer, which aresequentially stacked one on another from the opposing surface of thesubstrate.
 11. The manufacturing method of claim 10, wherein the thirdauxiliary layer includes a heat dissipating material having heatconductivity.
 12. The manufacturing method of claim 11, wherein the heatdissipating material is a carbon composite material including at leastone material selected from graphite, a carbon nanotube, a carbon fiber,and graphene.
 13. The manufacturing method of claim 11, wherein thethird auxiliary layer further includes a dispersant including adispersion photo-hardening resin.
 14. The manufacturing method of claim10, wherein: the first auxiliary layer includes at least one materialselected from an acryl-based resin, a butyl rubber, a vinyl acetateresin, an ethylene vinyl acetate resin, a natural rubber, nitriles, asilicate resin, a silicone rubber, and a styrene block polymer; and thesecond auxiliary layer includes at least one material selected from anacrylate-based compound including an acrylate-based polymer, apolyurethane, and SiO.
 15. The manufacturing method of claim 10, whereina connection part is disposed on the opposing surface of the substrateat the bending area, and the connection part includes a same material asthe second auxiliary layer.
 16. The manufacturing method of claim 1,wherein the first protection layer and the second protection layer arespaced apart from each other, and a space between the first protectionlayer and the second protection layer overlaps the bending area.
 17. Themanufacturing method of claim 1, wherein an inclination degree of theend of the first and second protection layers is controlled by adjustingan amount of droplets of the photo-hardening resin discharged to thesubstrate.
 18. The manufacturing method of claim 1, wherein the firstand second protection layers are provided without a separate adhesivelayer.
 19. The manufacturing method of claim 2, wherein an amount of thedischarged droplet is lower when the printing device is disposed at theside close to the bending area.
 20. The manufacturing method of claim19, wherein wherein the droplets discharged at each position of thesecond flat area are combined with each other and flow toward thebending area to form the second inclination part.